Your Trusted Partner in Power Semiconductor Solutions.

Technical Services

Hypersemi (Zhuhai Hypersemi Co., Ltd.) is a power semiconductor manufacturer (IGBT, SiC, MOSFET, modules and discretes) offering three professional service lines to customers worldwide: custom chip design, chip failure analysis, and wafer processing (CP test · wafer thinning · wafer dicing · IC programming). Backed by advanced equipment, a senior engineering team and standardized processes, we deliver one-stop support — from design and analysis to processing — for design houses, IDMs and end manufacturers.

Design Services

Two capability lines: custom chip design and failure analysis.

Processing Services

Wafer processing: CP test · thinning · dicing · programming.

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How we work

  1. 01

    Requirement review

    Share your specs, volumes and application — our engineers review feasibility and the best route.

  2. 02

    Proposal & quote

    Across chip design, failure analysis and wafer processing, we propose the right solution and terms.

  3. 03

    Execution & verification

    Standardized workflows keep you updated with data at key milestones.

  4. 04

    Delivery & support

    On-time delivery of reports or devices, with ongoing engineering support.

FAQ

What wafer sizes and thickness ranges do you support?
We handle 6-inch, 8-inch and 12-inch wafers. Standard thinning ranges from 100μm to 500μm, with ultra-thinning capabilities (e.g. below 50μm) for advanced packaging applications.
How does CP testing save cost?
Eliminating functionally defective or substandard chips early saves up to 80% on subsequent packaging and functional testing costs.
How is customer data and IP protected?
We prioritize customer intellectual property and data security with stringent confidentiality agreements and a robust data management system; NDA is supported by default for failure analysis projects.